GO1525-CTAE3

Manufacturer GENNUM CORPORATION
Part Number GO1525-CTAE3
Supply Voltage 2.25 ~ 2.75V

Voltage Controlled Oscillator

Key Features

  • generates 1.485GHz or 1.485/1.001GHz signal for HD-LINX™II ICs
  • low current consumption
  • 50Ω output impedance
  • operates from a single 2.5V supply
  • 8 pin tape on reel
  • Pb-free and RoHS Compliant

Applications

VCO for the GS1560, GS1559 and GS9060 Deserializers, and the GS1532, GS1531 and GS9062 Serializers

Description

The GO1525 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal for the GS1560 and GS9060 deserializers, and for the GS1532 and GS9062 serializers. The control voltage range is from 1.0 volts to 1.5 volts and is derived from the on-chip PLLs. The GO1525 frequency can be pulled approximately 32MHz for every one volt of control.

The output level is typically -9.0dBm with low spurious and noise content. It is designed to drive 50Ω strip lines.

The VCO requires a single 2.5V supply and draws a maximum of 15mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the normal commercial temperature range of 0°C to +70°C.

This component and all homogeneous subcomponents are RoHS compliant.

GO1555 for new designs

The GO1555 should be used for new designs given that it is smaller, consumes less power and gives better jitter performance.

Soldering Recommendations

The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2.

Reflow Conditions

The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows:

Soldering Flux

Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance.

Rework or Repair

Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering.

Endurance To Warp

When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the device will not be cracked or damaged.

Storage

Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability.

Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.).

Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded.

Transport

Package the devices for transportation to avoid mechanical vibration or shock.

ESD Warning

Avoid poor ground connections and electrostatic discharge or induction in production.

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